Electronic Assembly

Innerstep's printed circuit board assembly experience is one of our core competencies.

Our capabilities in PCB assembly include:

  • BGA placement, X-ray inspection, AOI Inspection, ball/deball and rework capability
  • Three full lines of Fuji SMT equipment
  • High and low volume fine pitch placement
  • Placement of 0201 passive components
  • POP device placement technology
  • Clean / No-clean processes, and Ionograph Contamination Testing
  • Lead and Lead-free processes
  • Wide format PCB's, rigid-flex, metal back & RF substrates
  • High-Capacity Dual Solder Wave Machine w/Spray Fluxer
  • In-Circuit test on multiple platforms (Genrad, HP and Teradyne)
  • Environmental Chamber Oven

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